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Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

by Wei, Xing-Chang,
Physical details: one online resource, 341 pages ; illustrations; ISBN: 9781138033566.
Subject(s): Printed circuits | Electronic packaging. | Electromagnetic compatibility.
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Cagayan State University University Library, Carig Campus
Tuguegarao City, Cagayan 3500 | www.csucarig.edu.ph

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